Equipment Highlights

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Capabilities Tour:
Molecular Decomposition Process (MDP)

Oberg's "advanced grinding technology" eliminates manufacturing barriers for using promising new metals and exotic alloys.

MDP, an advanced electro-chemical grinding technology, is used to grind or cut any conductive material without burrs or heat.
Smart MDP technology enables multi-axis movements to produce complex geometries while maintaining dimensional accuracy to the micron level.
Burr-free threads with a pitch of 0.25mm (101 threads per inch) can be produced in a single cut on 0.04 inch (1.016 mm) dia. nitinol wire requiring no secondary operations.
0.003 inch (0.0762 mm) wide slots were cut in 440C stainless steel, 56-58 RC to a depth of 0.025 inches (0.635 mm) in a single pass without burrs.
Full depth of cut grinds achieved in a single pass with no burrs producing slots 0.028 inches (0.711 mm) wide by 0.110 inches (2.794 mm) deep on 300 series stainless steel.
The MDP process was used to manufacture a complex hexalobe feature that needed to be within a 0.0005 inch (0.012 mm) tolerance range.